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Improved electro-mechanical performance of gold films on polyimide without adhesion layers
Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Pergamon
2015
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394137/ https://www.ncbi.nlm.nih.gov/pubmed/26041969 http://dx.doi.org/10.1016/j.scriptamat.2015.02.005 |