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The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model
Thin metal films deposited on polymer substrates are used in flexible electronic devices such as flexible displays or printed memories. They are often fabricated as complicated multilayer structures. Understanding the mechanical behavior of the interface between the metal film and the substrate as w...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Elsevier Science
2015
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394140/ https://www.ncbi.nlm.nih.gov/pubmed/25937805 http://dx.doi.org/10.1016/j.actamat.2015.01.047 |
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author | Marx, Vera M. Toth, Florian Wiesinger, Andreas Berger, Julia Kirchlechner, Christoph Cordill, Megan J. Fischer, Franz D. Rammerstorfer, Franz G. Dehm, Gerhard |
author_facet | Marx, Vera M. Toth, Florian Wiesinger, Andreas Berger, Julia Kirchlechner, Christoph Cordill, Megan J. Fischer, Franz D. Rammerstorfer, Franz G. Dehm, Gerhard |
author_sort | Marx, Vera M. |
collection | PubMed |
description | Thin metal films deposited on polymer substrates are used in flexible electronic devices such as flexible displays or printed memories. They are often fabricated as complicated multilayer structures. Understanding the mechanical behavior of the interface between the metal film and the substrate as well as the process of crack formation under global tension is important for producing reliable devices. In the present work, the deformation behavior of copper films (50–200 nm thick), bonded to polyimide directly or via a 10 nm chromium interlayer, is investigated by experimental analysis and computational simulations. The influence of the various copper film thicknesses and the usage of a brittle interlayer on the crack density as well as on the stress magnitude in the copper after saturation of the cracking process are studied with in situ tensile tests in a synchrotron and under an atomic force microscope. From the computational point of view, the evolution of the crack pattern is modeled as a stochastic process via finite element based cohesive zone simulations. Both, experiments and simulations show that the chromium interlayer dominates the deformation behavior. The interlayer forms cracks that induce a stress concentration in the overlying copper film. This behavior is more pronounced in the 50 nm than in the 200 nm copper films. |
format | Online Article Text |
id | pubmed-4394140 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2015 |
publisher | Elsevier Science |
record_format | MEDLINE/PubMed |
spelling | pubmed-43941402015-05-01 The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model Marx, Vera M. Toth, Florian Wiesinger, Andreas Berger, Julia Kirchlechner, Christoph Cordill, Megan J. Fischer, Franz D. Rammerstorfer, Franz G. Dehm, Gerhard Acta Mater Article Thin metal films deposited on polymer substrates are used in flexible electronic devices such as flexible displays or printed memories. They are often fabricated as complicated multilayer structures. Understanding the mechanical behavior of the interface between the metal film and the substrate as well as the process of crack formation under global tension is important for producing reliable devices. In the present work, the deformation behavior of copper films (50–200 nm thick), bonded to polyimide directly or via a 10 nm chromium interlayer, is investigated by experimental analysis and computational simulations. The influence of the various copper film thicknesses and the usage of a brittle interlayer on the crack density as well as on the stress magnitude in the copper after saturation of the cracking process are studied with in situ tensile tests in a synchrotron and under an atomic force microscope. From the computational point of view, the evolution of the crack pattern is modeled as a stochastic process via finite element based cohesive zone simulations. Both, experiments and simulations show that the chromium interlayer dominates the deformation behavior. The interlayer forms cracks that induce a stress concentration in the overlying copper film. This behavior is more pronounced in the 50 nm than in the 200 nm copper films. Elsevier Science 2015-05-01 /pmc/articles/PMC4394140/ /pubmed/25937805 http://dx.doi.org/10.1016/j.actamat.2015.01.047 Text en © 2015 Acta Materialia Inc. Elsevier Ltd. All rights reserved. http://creativecommons.org/licenses/by/4.0/ This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Marx, Vera M. Toth, Florian Wiesinger, Andreas Berger, Julia Kirchlechner, Christoph Cordill, Megan J. Fischer, Franz D. Rammerstorfer, Franz G. Dehm, Gerhard The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title | The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title_full | The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title_fullStr | The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title_full_unstemmed | The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title_short | The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model |
title_sort | influence of a brittle cr interlayer on the deformation behavior of thin cu films on flexible substrates: experiment and model |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394140/ https://www.ncbi.nlm.nih.gov/pubmed/25937805 http://dx.doi.org/10.1016/j.actamat.2015.01.047 |
work_keys_str_mv | AT marxveram theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT tothflorian theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT wiesingerandreas theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT bergerjulia theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT kirchlechnerchristoph theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT cordillmeganj theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT fischerfranzd theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT rammerstorferfranzg theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT dehmgerhard theinfluenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT marxveram influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT tothflorian influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT wiesingerandreas influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT bergerjulia influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT kirchlechnerchristoph influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT cordillmeganj influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT fischerfranzd influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT rammerstorferfranzg influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel AT dehmgerhard influenceofabrittlecrinterlayeronthedeformationbehaviorofthincufilmsonflexiblesubstratesexperimentandmodel |