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Elimination of strength degrading effects caused by surface microdefect: A prevention achieved by silicon nanotexturing to avoid catastrophic brittle fracture
The unavoidable occurrence of microdefects in silicon wafers increase the probability of catastrophic fracture of silicon-based devices, thus highlighting the need for a strengthening mechanism to minimize fractures resulting from defects. In this study, a novel mechanism for manufacturing silicon w...
Autores principales: | Kashyap, Kunal, Kumar, Amarendra, Huang, Chuan-Torng, Lin, Yu-Yun, Hou, Max T., Andrew Yeh, J. |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2015
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4455193/ https://www.ncbi.nlm.nih.gov/pubmed/26040924 http://dx.doi.org/10.1038/srep10869 |
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