Bottom-up assembly of metallic germanium

Extending chip performance beyond current limits of miniaturisation requires new materials and functionalities that integrate well with the silicon platform. Germanium fits these requirements and has been proposed as a high-mobility channel material, a light emitting medium in silicon-integrated las...

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Detalles Bibliográficos
Autores principales: Scappucci, Giordano, Klesse, Wolfgang M., Yeoh, LaReine A., Carter, Damien J., Warschkow, Oliver, Marks, Nigel A., Jaeger, David L., Capellini, Giovanni, Simmons, Michelle Y., Hamilton, Alexander R.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4530340/
https://www.ncbi.nlm.nih.gov/pubmed/26256239
http://dx.doi.org/10.1038/srep12948

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