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A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity
Conductive ink using copper nanoparticles has attracted much attention in the printed electronics industry because of its low cost and high electrical conductivity. However, the problem of easy oxidation under heat and humidity conditions for copper material limits the wide applications. In this stu...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer US
2015
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4569602/ https://www.ncbi.nlm.nih.gov/pubmed/26370132 http://dx.doi.org/10.1186/s11671-015-1069-y |
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author | Tsai, Chia-Yang Chang, Wei-Chen Chen, Guan-Lin Chung, Cheng-Huan Liang, Jun-Xiang Ma, Wei-Yang Yang, Tsun-Neng |
author_facet | Tsai, Chia-Yang Chang, Wei-Chen Chen, Guan-Lin Chung, Cheng-Huan Liang, Jun-Xiang Ma, Wei-Yang Yang, Tsun-Neng |
author_sort | Tsai, Chia-Yang |
collection | PubMed |
description | Conductive ink using copper nanoparticles has attracted much attention in the printed electronics industry because of its low cost and high electrical conductivity. However, the problem of easy oxidation under heat and humidity conditions for copper material limits the wide applications. In this study, antioxidative copper inks were prepared by dispersing the nanoparticles in the solution, and then conductive copper films can be obtained after calcining the copper ink at 250 °C in nitrogen atmosphere for 30 min. A low sheet resistance of 47.6 mΩ/□ for the copper film was measured by using the four-point probe method. Importantly, we experimentally demonstrate that the electrical conductivity of copper films can be improved by increasing the calcination temperature. In addition, these highly conductive copper films can be placed in an atmospheric environment for more than 6 months without the oxidation phenomenon, which was verified by energy-dispersive X-ray spectroscopy (EDS). These observations strongly show that our conductive copper ink features high antioxidant properties and long-term stability and has a great potential for many printed electronics applications, such as flexible display systems, sensors, photovoltaic cells, and radio frequency identification. |
format | Online Article Text |
id | pubmed-4569602 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2015 |
publisher | Springer US |
record_format | MEDLINE/PubMed |
spelling | pubmed-45696022015-09-18 A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity Tsai, Chia-Yang Chang, Wei-Chen Chen, Guan-Lin Chung, Cheng-Huan Liang, Jun-Xiang Ma, Wei-Yang Yang, Tsun-Neng Nanoscale Res Lett Nano Express Conductive ink using copper nanoparticles has attracted much attention in the printed electronics industry because of its low cost and high electrical conductivity. However, the problem of easy oxidation under heat and humidity conditions for copper material limits the wide applications. In this study, antioxidative copper inks were prepared by dispersing the nanoparticles in the solution, and then conductive copper films can be obtained after calcining the copper ink at 250 °C in nitrogen atmosphere for 30 min. A low sheet resistance of 47.6 mΩ/□ for the copper film was measured by using the four-point probe method. Importantly, we experimentally demonstrate that the electrical conductivity of copper films can be improved by increasing the calcination temperature. In addition, these highly conductive copper films can be placed in an atmospheric environment for more than 6 months without the oxidation phenomenon, which was verified by energy-dispersive X-ray spectroscopy (EDS). These observations strongly show that our conductive copper ink features high antioxidant properties and long-term stability and has a great potential for many printed electronics applications, such as flexible display systems, sensors, photovoltaic cells, and radio frequency identification. Springer US 2015-09-15 /pmc/articles/PMC4569602/ /pubmed/26370132 http://dx.doi.org/10.1186/s11671-015-1069-y Text en © Tsai et al. 2015 Open AccessThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. |
spellingShingle | Nano Express Tsai, Chia-Yang Chang, Wei-Chen Chen, Guan-Lin Chung, Cheng-Huan Liang, Jun-Xiang Ma, Wei-Yang Yang, Tsun-Neng A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title | A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title_full | A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title_fullStr | A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title_full_unstemmed | A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title_short | A Study of the Preparation and Properties of Antioxidative Copper Inks with High Electrical Conductivity |
title_sort | study of the preparation and properties of antioxidative copper inks with high electrical conductivity |
topic | Nano Express |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4569602/ https://www.ncbi.nlm.nih.gov/pubmed/26370132 http://dx.doi.org/10.1186/s11671-015-1069-y |
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