Cargando…

Mechanical Flip-Chip for Ultra-High Electron Mobility Devices

Electrostatic gates are of paramount importance for the physics of devices based on high-mobility two-dimensional electron gas (2DEG) since they allow depletion of electrons in selected areas. This field-effect gating enables the fabrication of a wide range of devices such as, for example, quantum p...

Descripción completa

Detalles Bibliográficos
Autores principales:	Bennaceur, Keyan, Schmidt, Benjamin A., Gaucher, Samuel, Laroche, Dominique, Lilly, Michael P., Reno, John L., West, Ken W., Pfeiffer, Loren N., Gervais, Guillaume
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Nature Publishing Group 2015
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4585730/ https://www.ncbi.nlm.nih.gov/pubmed/26391400 http://dx.doi.org/10.1038/srep13494

Ejemplares similares

Advanced flip chip packaging
por: Tong, Ho-Ming, et al.
Publicado: (2013)

Carbon nanotube bumps for the flip chip packaging system
por: Yap, Chin Chong, et al.
Publicado: (2012)

Anomalous electronic transport in high-mobility Corbino rings
por: Vijayakrishnan, Sujatha, et al.
Publicado: (2023)

Flip chip assembly of thinned chips for hybrid pixel detector applications
por: Fritzsch, T, et al.
Publicado: (2014)

An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
por: Chen, Zehua, et al.
Publicado: (2022)

Induced superconductivity in high-mobility two-dimensional electron gas in gallium arsenide heterostructures
por: Wan, Zhong, et al.
Publicado: (2015)

Flip-chip interconnection of 100 k pixel hybrid detectors
por: Humpston, G
Publicado: (1998)

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process
por: Chuang, Wan-Chun, et al.
Publicado: (2022)

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP
por: Yan, Lei, et al.
Publicado: (2023)

Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies
por: Lee, Ning-Cheng
Publicado: (2001)

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer
por: Su, Lei, et al.
Publicado: (2013)

Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer
por: Hong, Kuo-Bin, et al.
Publicado: (2023)

Screen printing and chip flipping techniques for large area hybrid pixel bonding
por: Bonvicini, V, et al.
Publicado: (1995)

Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer
por: Liang, Jinxing, et al.
Publicado: (2015)

Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall
por: Tang, Bin, et al.
Publicado: (2019)

Thermal Characterisation of Hybrid, Flip-Chip InP-Si DFB Lasers
por: Coenen, David, et al.
Publicado: (2023)

Fast frequency-sweep spectroscopic imaging with an ultra-low flip angle
por: Guo, Junyu, et al.
Publicado: (2016)

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
por: Chang, Yuan-Wei, et al.
Publicado: (2017)

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication
por: Cheng, Hsien-Chie, et al.
Publicado: (2021)

Increased Light Extraction of Thin-Film Flip-Chip UVB LEDs by Surface Texturing
por: Bergmann, Michael A., et al.
Publicado: (2023)

SU(5): to flip or not to flip
por: Nanopoulos, Dimitri V
Publicado: (1988)

A Microfluidic Flip-Chip Combining Hydrodynamic Trapping and Gravitational Sedimentation for Cell Pairing and Fusion
por: Pendharkar, Gaurav, et al.
Publicado: (2021)

Flipping the flipped: the co-creational classroom
por: Uskoković, Vuk
Publicado: (2018)

High-Sensitivity Low-Noise Miniature Fluxgate Magnetometers Using a Flip Chip Conceptual Design
por: Lu, Chih-Cheng, et al.
Publicado: (2014)

Light extraction efficiency enhancement of flip-chip blue light-emitting diodes by anodic aluminum oxide
por: Huang, Yi-Ru, et al.
Publicado: (2018)

Phosphor-Free InGaN White Light Emitting Diodes Using Flip-Chip Technology
por: Li, Ying-Chang, et al.
Publicado: (2017)

Study on Modulation Bandwidth and Light Extraction Efficiency of Flip-Chip Light-Emitting Diode with Photonic Crystals
por: Wang, Hong, et al.
Publicado: (2019)

End-to-End Sleep Staging Using Nocturnal Sounds from Microphone Chips for Mobile Devices
por: Hong, Joonki, et al.
Publicado: (2022)

Ultra-low-loss on-chip zero-index materials
por: Dong, Tian, et al.
Publicado: (2021)

Electronic Raman scattering as an ultra-sensitive probe of strain effects in semiconductors
por: Fluegel, Brian, et al.
Publicado: (2015)

Characterization of Ni/SnPb-TiW/Pt Flip Chip Interconnections in Silicon Pixel Detector Modules
por: Karadzhinova, Aneliya, et al.
Publicado: (2014)

Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method
por: Saitô, Y, et al.
Publicado: (1993)

Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
por: Tsai, Ming-Yi, et al.
Publicado: (2021)

Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications
por: Lee, Jongwon, et al.
Publicado: (2022)

Power Enhancement of 265 nm DUV-LED Flip-Chip by HVPE-AlN High-Temperature Annealing
por: Yue, Wenkai, et al.
Publicado: (2023)

FLIP the Switch: Regulation of Apoptosis and Necroptosis by cFLIP
por: Tsuchiya, Yuichi, et al.
Publicado: (2015)

Commentary: To flip or not to flip: Approaching the minimally invasive lobectomy
por: Fernandez, Ramiro, et al.
Publicado: (2021)

Ultra-Sensitive Nanofiber Fluorescence Detection in a Microfluidic Chip
por: Li, Zhiyong, et al.
Publicado: (2015)

Ultra-broadband on-chip twisted light emitter for optical communications
por: Xie, Zhenwei, et al.
Publicado: (2018)

Ultra-broadband spectrometer on a chip of picometer scale resolution
por: Karabchevsky, Alina
Publicado: (2023)

Cannot write session to /tmp/vufind_sessions/sess_ain1n7gtqkck643vvmhi9e7foq