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Effects of Thermal and Mechanical Load Cycling on the Dentin Microtensile Bond Strength of Single Bond-2

BACKGROUND: Different studies have shown the uncertain effects of thermal cycling (TC) and mechanical load cycling (MC) on the dentin microtensile bond strength (µTBS) of composites. This study designed to investigate the effects of TC and MC on the dentin µTBS of single bond-2. MATERIALS AND METHOD...

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Detalles Bibliográficos
Autores principales: Daneshkazemi, Alireza, Davari, Abdolrahim, Akbari, Mohammad Javad, Davoudi, Amin, Badrian, Hamid
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Dentmedpub Research and Printing Co 2015
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4588799/
https://www.ncbi.nlm.nih.gov/pubmed/26464532
Descripción
Sumario:BACKGROUND: Different studies have shown the uncertain effects of thermal cycling (TC) and mechanical load cycling (MC) on the dentin microtensile bond strength (µTBS) of composites. This study designed to investigate the effects of TC and MC on the dentin µTBS of single bond-2. MATERIALS AND METHODS: Flat dentinal surface was prepared on 48 sound extracted human third molar teeth, and were bonded by single bond-2 adhesive and Z250 resin composite. The teeth were randomly divided into eight equal groups, according to the thermal/mechanical protocol. TC and MC were proceeded at 5-55°C and 90 N with 0.5 Hz. Then restorations were sectioned to shape the hour-glass form and subjected to µTBS testing at a speed of 0.5 mm/min. To evaluate the bonding failure, the specimens were observed under the scanning electron microscope. The results were statistically analyzed with analysis of variance, t-test, Tukey HSD and post-hoc by using SPSS software version 17 at a significant level of 0.05. RESULTS: µTBS of all groups were significantly lower than the control group (P < 0.001). Adhesive failure was predominant in all groups and increased with TC and MC. CONCLUSIONS: TC and MC had an adverse effect on µTBS of the tested adhesive resin to dentin.