Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz w...

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Detalles Bibliográficos
Autores principales: Liang, Jinxing, Zhang, Liyuan, Wang, Ling, Dong, Yuan, Ueda, Toshitsugu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4610569/
https://www.ncbi.nlm.nih.gov/pubmed/26340632
http://dx.doi.org/10.3390/s150922049

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4610569/
https://www.ncbi.nlm.nih.gov/pubmed/26340632
http://dx.doi.org/10.3390/s150922049

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