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Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer
In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz w...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2015
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4610569/ https://www.ncbi.nlm.nih.gov/pubmed/26340632 http://dx.doi.org/10.3390/s150922049 |