Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat mo...

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Detalles Bibliográficos
Autores principales: Zhou, Xiuyun, Zhou, Jinlong, Tian, Guiyun, Wang, Yizhe
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4634459/
https://www.ncbi.nlm.nih.gov/pubmed/26473871
http://dx.doi.org/10.3390/s151025882

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4634459/
https://www.ncbi.nlm.nih.gov/pubmed/26473871
http://dx.doi.org/10.3390/s151025882

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