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A promising structure for fabricating high strength and high electrical conductivity copper alloys
To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment p...
Autores principales: | , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4746762/ https://www.ncbi.nlm.nih.gov/pubmed/26856764 http://dx.doi.org/10.1038/srep20799 |
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author | Li, Rengeng Kang, Huijun Chen, Zongning Fan, Guohua Zou, Cunlei Wang, Wei Zhang, Shaojian Lu, Yiping Jie, Jinchuan Cao, Zhiqiang Li, Tingju Wang, Tongmin |
author_facet | Li, Rengeng Kang, Huijun Chen, Zongning Fan, Guohua Zou, Cunlei Wang, Wei Zhang, Shaojian Lu, Yiping Jie, Jinchuan Cao, Zhiqiang Li, Tingju Wang, Tongmin |
author_sort | Li, Rengeng |
collection | PubMed |
description | To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu(5)Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application. |
format | Online Article Text |
id | pubmed-4746762 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2016 |
publisher | Nature Publishing Group |
record_format | MEDLINE/PubMed |
spelling | pubmed-47467622016-02-17 A promising structure for fabricating high strength and high electrical conductivity copper alloys Li, Rengeng Kang, Huijun Chen, Zongning Fan, Guohua Zou, Cunlei Wang, Wei Zhang, Shaojian Lu, Yiping Jie, Jinchuan Cao, Zhiqiang Li, Tingju Wang, Tongmin Sci Rep Article To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu(5)Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application. Nature Publishing Group 2016-02-09 /pmc/articles/PMC4746762/ /pubmed/26856764 http://dx.doi.org/10.1038/srep20799 Text en Copyright © 2016, Macmillan Publishers Limited http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/ |
spellingShingle | Article Li, Rengeng Kang, Huijun Chen, Zongning Fan, Guohua Zou, Cunlei Wang, Wei Zhang, Shaojian Lu, Yiping Jie, Jinchuan Cao, Zhiqiang Li, Tingju Wang, Tongmin A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title | A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title_full | A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title_fullStr | A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title_full_unstemmed | A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title_short | A promising structure for fabricating high strength and high electrical conductivity copper alloys |
title_sort | promising structure for fabricating high strength and high electrical conductivity copper alloys |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4746762/ https://www.ncbi.nlm.nih.gov/pubmed/26856764 http://dx.doi.org/10.1038/srep20799 |
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