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A promising structure for fabricating high strength and high electrical conductivity copper alloys

To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment p...

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Autores principales: Li, Rengeng, Kang, Huijun, Chen, Zongning, Fan, Guohua, Zou, Cunlei, Wang, Wei, Zhang, Shaojian, Lu, Yiping, Jie, Jinchuan, Cao, Zhiqiang, Li, Tingju, Wang, Tongmin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4746762/
https://www.ncbi.nlm.nih.gov/pubmed/26856764
http://dx.doi.org/10.1038/srep20799
_version_ 1782414858467147776
author Li, Rengeng
Kang, Huijun
Chen, Zongning
Fan, Guohua
Zou, Cunlei
Wang, Wei
Zhang, Shaojian
Lu, Yiping
Jie, Jinchuan
Cao, Zhiqiang
Li, Tingju
Wang, Tongmin
author_facet Li, Rengeng
Kang, Huijun
Chen, Zongning
Fan, Guohua
Zou, Cunlei
Wang, Wei
Zhang, Shaojian
Lu, Yiping
Jie, Jinchuan
Cao, Zhiqiang
Li, Tingju
Wang, Tongmin
author_sort Li, Rengeng
collection PubMed
description To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu(5)Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.
format Online
Article
Text
id pubmed-4746762
institution National Center for Biotechnology Information
language English
publishDate 2016
publisher Nature Publishing Group
record_format MEDLINE/PubMed
spelling pubmed-47467622016-02-17 A promising structure for fabricating high strength and high electrical conductivity copper alloys Li, Rengeng Kang, Huijun Chen, Zongning Fan, Guohua Zou, Cunlei Wang, Wei Zhang, Shaojian Lu, Yiping Jie, Jinchuan Cao, Zhiqiang Li, Tingju Wang, Tongmin Sci Rep Article To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu(5)Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application. Nature Publishing Group 2016-02-09 /pmc/articles/PMC4746762/ /pubmed/26856764 http://dx.doi.org/10.1038/srep20799 Text en Copyright © 2016, Macmillan Publishers Limited http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Li, Rengeng
Kang, Huijun
Chen, Zongning
Fan, Guohua
Zou, Cunlei
Wang, Wei
Zhang, Shaojian
Lu, Yiping
Jie, Jinchuan
Cao, Zhiqiang
Li, Tingju
Wang, Tongmin
A promising structure for fabricating high strength and high electrical conductivity copper alloys
title A promising structure for fabricating high strength and high electrical conductivity copper alloys
title_full A promising structure for fabricating high strength and high electrical conductivity copper alloys
title_fullStr A promising structure for fabricating high strength and high electrical conductivity copper alloys
title_full_unstemmed A promising structure for fabricating high strength and high electrical conductivity copper alloys
title_short A promising structure for fabricating high strength and high electrical conductivity copper alloys
title_sort promising structure for fabricating high strength and high electrical conductivity copper alloys
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4746762/
https://www.ncbi.nlm.nih.gov/pubmed/26856764
http://dx.doi.org/10.1038/srep20799
work_keys_str_mv AT lirengeng apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT kanghuijun apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT chenzongning apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT fanguohua apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT zoucunlei apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT wangwei apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT zhangshaojian apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT luyiping apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT jiejinchuan apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT caozhiqiang apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT litingju apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT wangtongmin apromisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT lirengeng promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT kanghuijun promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT chenzongning promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT fanguohua promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT zoucunlei promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT wangwei promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT zhangshaojian promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT luyiping promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT jiejinchuan promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT caozhiqiang promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT litingju promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys
AT wangtongmin promisingstructureforfabricatinghighstrengthandhighelectricalconductivitycopperalloys