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Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding

Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transpo...

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Autores principales: Zhang, Xiaoliang, Gao, Yufei, Chen, Yuli, Hu, Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4766486/
https://www.ncbi.nlm.nih.gov/pubmed/26911859
http://dx.doi.org/10.1038/srep22011
_version_ 1782417675091181568
author Zhang, Xiaoliang
Gao, Yufei
Chen, Yuli
Hu, Ming
author_facet Zhang, Xiaoliang
Gao, Yufei
Chen, Yuli
Hu, Ming
author_sort Zhang, Xiaoliang
collection PubMed
description Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the effect of interlayer covalent bonding, in particular different interlay bonding arrangement, on the thermal conductivity of bilayer graphene using equilibrium molecular dynamics simulations. It is revealed that, the thermal conductivity of randomly bonded bilayer graphene decreases monotonically with the increase of interlayer bonding density, however, for the regularly bonded bilayer graphene structure the thermal conductivity possesses unexpectedly non-monotonic dependence on the interlayer bonding density. The results suggest that the thermal conductivity of bilayer graphene depends not only on the interlayer bonding density, but also on the detailed topological configuration of the interlayer bonding. The underlying mechanism for this abnormal phenomenon is identified by means of phonon spectral energy density, participation ratio and mode weight factor analysis. The large tunability of thermal conductivity of bilayer graphene through rational interlayer bonding arrangement paves the way to achieve other desired properties for potential nanoelectronics applications involving graphene layers.
format Online
Article
Text
id pubmed-4766486
institution National Center for Biotechnology Information
language English
publishDate 2016
publisher Nature Publishing Group
record_format MEDLINE/PubMed
spelling pubmed-47664862016-03-02 Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding Zhang, Xiaoliang Gao, Yufei Chen, Yuli Hu, Ming Sci Rep Article Graphene and its bilayer structure are the two-dimensional crystalline form of carbon, whose extraordinary electron mobility and other unique features hold great promise for nanoscale electronics and photonics. Their realistic applications in emerging nanoelectronics usually call for thermal transport manipulation in a controllable and precise manner. In this paper we systematically studied the effect of interlayer covalent bonding, in particular different interlay bonding arrangement, on the thermal conductivity of bilayer graphene using equilibrium molecular dynamics simulations. It is revealed that, the thermal conductivity of randomly bonded bilayer graphene decreases monotonically with the increase of interlayer bonding density, however, for the regularly bonded bilayer graphene structure the thermal conductivity possesses unexpectedly non-monotonic dependence on the interlayer bonding density. The results suggest that the thermal conductivity of bilayer graphene depends not only on the interlayer bonding density, but also on the detailed topological configuration of the interlayer bonding. The underlying mechanism for this abnormal phenomenon is identified by means of phonon spectral energy density, participation ratio and mode weight factor analysis. The large tunability of thermal conductivity of bilayer graphene through rational interlayer bonding arrangement paves the way to achieve other desired properties for potential nanoelectronics applications involving graphene layers. Nature Publishing Group 2016-02-25 /pmc/articles/PMC4766486/ /pubmed/26911859 http://dx.doi.org/10.1038/srep22011 Text en Copyright © 2016, Macmillan Publishers Limited http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Zhang, Xiaoliang
Gao, Yufei
Chen, Yuli
Hu, Ming
Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title_full Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title_fullStr Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title_full_unstemmed Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title_short Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding
title_sort robustly engineering thermal conductivity of bilayer graphene by interlayer bonding
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4766486/
https://www.ncbi.nlm.nih.gov/pubmed/26911859
http://dx.doi.org/10.1038/srep22011
work_keys_str_mv AT zhangxiaoliang robustlyengineeringthermalconductivityofbilayergraphenebyinterlayerbonding
AT gaoyufei robustlyengineeringthermalconductivityofbilayergraphenebyinterlayerbonding
AT chenyuli robustlyengineeringthermalconductivityofbilayergraphenebyinterlayerbonding
AT huming robustlyengineeringthermalconductivityofbilayergraphenebyinterlayerbonding