Cargando…
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns
Micrometer copper columns were fabricated via a technology named localized electrochemical deposition (LECD). This paper studies the effects of applied potential and the initial gap between electrodes on the LECD process. The surface and cross sectional morphologies, as well as the average depositio...
Autores principales: | Wang, Fuliang, Xiao, Hongbin, He, Hu |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group
2016
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4869097/ https://www.ncbi.nlm.nih.gov/pubmed/27185742 http://dx.doi.org/10.1038/srep26270 |
Ejemplares similares
-
On Micrometers Applied to Microscopes
por: Robertson, William
Publicado: (1851) -
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities
por: Wang, Fuliang, et al.
Publicado: (2017) -
Nanoscale Size-Selective Deposition of Nanowires by Micrometer Scale Hydrophilic Patterns
por: He, Yong, et al.
Publicado: (2014) -
Micrometers
por: Ford, D. R.
Publicado: (1885) -
High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates
por: Łysień, Mateusz, et al.
Publicado: (2022)