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Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications

The integration of porous metal-organic frameworks onto the surface of materials, for use as functional devices, is currently emerging as a promising approach for gas sensing and flexible displays. However, research focused on potential applications in electronic devices is in its infancy. Here we p...

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Autores principales: Li, Wei-Jin, Liu, Juan, Sun, Zhi-Hua, Liu, Tian-Fu, Lü, Jian, Gao, Shui-Ying, He, Chao, Cao, Rong, Luo, Jun-Hua
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4906389/
https://www.ncbi.nlm.nih.gov/pubmed/27282348
http://dx.doi.org/10.1038/ncomms11830
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author Li, Wei-Jin
Liu, Juan
Sun, Zhi-Hua
Liu, Tian-Fu
Lü, Jian
Gao, Shui-Ying
He, Chao
Cao, Rong
Luo, Jun-Hua
author_facet Li, Wei-Jin
Liu, Juan
Sun, Zhi-Hua
Liu, Tian-Fu
Lü, Jian
Gao, Shui-Ying
He, Chao
Cao, Rong
Luo, Jun-Hua
author_sort Li, Wei-Jin
collection PubMed
description The integration of porous metal-organic frameworks onto the surface of materials, for use as functional devices, is currently emerging as a promising approach for gas sensing and flexible displays. However, research focused on potential applications in electronic devices is in its infancy. Here we present a facile strategy by which interpenetrated, crystalline metal-organic framework films are deposited onto conductive metal-plate anodes via in situ temperature-controlled electrochemical assembly. The nanostructure of the surface as well as the thickness and uniformity of the film are well controlled. More importantly, the resulting films exhibit enhanced dielectric properties compared to traditional inorganic or organic gate dielectrics. This study demonstrates the successful implementation of the rational design of metal-organic framework thin films on conductive supports with high-performance dielectric properties.
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spelling pubmed-49063892016-06-24 Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications Li, Wei-Jin Liu, Juan Sun, Zhi-Hua Liu, Tian-Fu Lü, Jian Gao, Shui-Ying He, Chao Cao, Rong Luo, Jun-Hua Nat Commun Article The integration of porous metal-organic frameworks onto the surface of materials, for use as functional devices, is currently emerging as a promising approach for gas sensing and flexible displays. However, research focused on potential applications in electronic devices is in its infancy. Here we present a facile strategy by which interpenetrated, crystalline metal-organic framework films are deposited onto conductive metal-plate anodes via in situ temperature-controlled electrochemical assembly. The nanostructure of the surface as well as the thickness and uniformity of the film are well controlled. More importantly, the resulting films exhibit enhanced dielectric properties compared to traditional inorganic or organic gate dielectrics. This study demonstrates the successful implementation of the rational design of metal-organic framework thin films on conductive supports with high-performance dielectric properties. Nature Publishing Group 2016-06-10 /pmc/articles/PMC4906389/ /pubmed/27282348 http://dx.doi.org/10.1038/ncomms11830 Text en Copyright © 2016, Nature Publishing Group, a division of Macmillan Publishers Limited. All Rights Reserved. http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article's Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Li, Wei-Jin
Liu, Juan
Sun, Zhi-Hua
Liu, Tian-Fu
Lü, Jian
Gao, Shui-Ying
He, Chao
Cao, Rong
Luo, Jun-Hua
Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title_full Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title_fullStr Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title_full_unstemmed Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title_short Integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
title_sort integration of metal-organic frameworks into an electrochemical dielectric thin film for electronic applications
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4906389/
https://www.ncbi.nlm.nih.gov/pubmed/27282348
http://dx.doi.org/10.1038/ncomms11830
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