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Dispersion of Heat Flux Sensors Manufactured in Silicon Technology

In this paper, we focus on the dispersion performances related to the manufacturing process of heat flux sensors realized in CMOS (Complementary metal oxide semi-conductor) compatible 3-in technology. In particular, we have studied the performance dispersion of our sensors and linked these to the ph...

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Autores principales: Ziouche, Katir, Lejeune, Pascale, Bougrioua, Zahia, Leclercq, Didier
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4934279/
https://www.ncbi.nlm.nih.gov/pubmed/27294929
http://dx.doi.org/10.3390/s16060853
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author Ziouche, Katir
Lejeune, Pascale
Bougrioua, Zahia
Leclercq, Didier
author_facet Ziouche, Katir
Lejeune, Pascale
Bougrioua, Zahia
Leclercq, Didier
author_sort Ziouche, Katir
collection PubMed
description In this paper, we focus on the dispersion performances related to the manufacturing process of heat flux sensors realized in CMOS (Complementary metal oxide semi-conductor) compatible 3-in technology. In particular, we have studied the performance dispersion of our sensors and linked these to the physical characteristics of dispersion of the materials used. This information is mandatory to ensure low-cost manufacturing and especially to reduce production rejects during the fabrication process. The results obtained show that the measured sensitivity of the sensors is in the range 3.15 to 6.56 μV/(W/m(2)), associated with measured resistances ranging from 485 to 675 kΩ. The dispersions correspond to a Gaussian-type distribution with more than 90% determined around average sensitivity [Formula: see text] = 4.5 µV/(W/m(2)) and electrical resistance [Formula: see text] = 573.5 kΩ within the interval between the average and, more or less, twice the relative standard deviation.
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spelling pubmed-49342792016-07-06 Dispersion of Heat Flux Sensors Manufactured in Silicon Technology Ziouche, Katir Lejeune, Pascale Bougrioua, Zahia Leclercq, Didier Sensors (Basel) Article In this paper, we focus on the dispersion performances related to the manufacturing process of heat flux sensors realized in CMOS (Complementary metal oxide semi-conductor) compatible 3-in technology. In particular, we have studied the performance dispersion of our sensors and linked these to the physical characteristics of dispersion of the materials used. This information is mandatory to ensure low-cost manufacturing and especially to reduce production rejects during the fabrication process. The results obtained show that the measured sensitivity of the sensors is in the range 3.15 to 6.56 μV/(W/m(2)), associated with measured resistances ranging from 485 to 675 kΩ. The dispersions correspond to a Gaussian-type distribution with more than 90% determined around average sensitivity [Formula: see text] = 4.5 µV/(W/m(2)) and electrical resistance [Formula: see text] = 573.5 kΩ within the interval between the average and, more or less, twice the relative standard deviation. MDPI 2016-06-09 /pmc/articles/PMC4934279/ /pubmed/27294929 http://dx.doi.org/10.3390/s16060853 Text en © 2016 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Ziouche, Katir
Lejeune, Pascale
Bougrioua, Zahia
Leclercq, Didier
Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title_full Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title_fullStr Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title_full_unstemmed Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title_short Dispersion of Heat Flux Sensors Manufactured in Silicon Technology
title_sort dispersion of heat flux sensors manufactured in silicon technology
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4934279/
https://www.ncbi.nlm.nih.gov/pubmed/27294929
http://dx.doi.org/10.3390/s16060853
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