Electronic Conduction in Ti/Poly-TiO(2)/Ti Structures

Recent intensive investigations on metal/metal oxide/metal structures have targeted nanometric single grain oxides at high electric fields. Similar research on thicker polycrystalline oxide layers can bridge the results to the prior literature on varistors and may uncover novel ionic/electronic features originating from the conduction mechanisms involving grain boundaries. Here, we investigate electronic conduction in Ti/poly-TiO(2−x)/Ti structures with different oxygen vacancy distributions and describe the observed features based on the motion and rearrangement of the ionized oxygen vacancies (IOVs) on the grain facets rather than the grain interiors. Containing no interface energy barrier, Ti/poly-TiO(2)/Ti devices demonstrate high resistance ohmic conduction at biasing fields below 5 × 10(6) V.m(−1); higher fields drive the samples to a distinctly nonlinear and hysteretic low resistance status. The observed threshold is two orders of magnitude smaller than the typical resistance switching fields reported for the nanosized single grain memristors. This is consistent with the smaller activation energies reported for the IOV motion on the rutile facets than its interior. The presented model describes the observed dependence of the threshold field on the relative humidity of the surrounding air based on the lower activation energies reported for the hydroxyl-assisted IOV motion on the rutile facets.