Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potent...

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Detalles Bibliográficos
Autores principales: Wei, Chenhuinan, Wu, Guoxing, Yang, Sanjun, Liu, Qiming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5062162/
https://www.ncbi.nlm.nih.gov/pubmed/27734900
http://dx.doi.org/10.1038/srep34779
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author Wei, Chenhuinan
Wu, Guoxing
Yang, Sanjun
Liu, Qiming
author_facet Wei, Chenhuinan
Wu, Guoxing
Yang, Sanjun
Liu, Qiming
author_sort Wei, Chenhuinan
collection PubMed
description In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films.
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spelling pubmed-50621622016-10-24 Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation Wei, Chenhuinan Wu, Guoxing Yang, Sanjun Liu, Qiming Sci Rep Article In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films. Nature Publishing Group 2016-10-13 /pmc/articles/PMC5062162/ /pubmed/27734900 http://dx.doi.org/10.1038/srep34779 Text en Copyright © 2016, The Author(s) http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Wei, Chenhuinan
Wu, Guoxing
Yang, Sanjun
Liu, Qiming
Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title_full Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title_fullStr Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title_full_unstemmed Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title_short Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
title_sort electrochemical deposition of layered copper thin films based on the diffusion limited aggregation
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5062162/
https://www.ncbi.nlm.nih.gov/pubmed/27734900
http://dx.doi.org/10.1038/srep34779
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AT wuguoxing electrochemicaldepositionoflayeredcopperthinfilmsbasedonthediffusionlimitedaggregation
AT yangsanjun electrochemicaldepositionoflayeredcopperthinfilmsbasedonthediffusionlimitedaggregation
AT liuqiming electrochemicaldepositionoflayeredcopperthinfilmsbasedonthediffusionlimitedaggregation

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