Wafer-Level Vacuum Packaging of Smart Sensors

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, w...

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Detalles Bibliográficos
Autores principales: Hilton, Allan, Temple, Dorota S.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5134478/
https://www.ncbi.nlm.nih.gov/pubmed/27809249
http://dx.doi.org/10.3390/s16111819

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5134478/
https://www.ncbi.nlm.nih.gov/pubmed/27809249
http://dx.doi.org/10.3390/s16111819

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