Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (T...

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Detalles Bibliográficos
Autores principales: He, Fei, Yu, Junjie, Tan, Yuanxin, Chu, Wei, Zhou, Changhe, Cheng, Ya, Sugioka, Koji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5241677/
https://www.ncbi.nlm.nih.gov/pubmed/28098250
http://dx.doi.org/10.1038/srep40785

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5241677/
https://www.ncbi.nlm.nih.gov/pubmed/28098250
http://dx.doi.org/10.1038/srep40785

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