Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition

A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This...

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Detalles Bibliográficos
Autores principales: Liang, Suqing, Li, Yaoyao, Zhou, Tingjiao, Yang, Jinbin, Zhou, Xiaohu, Zhu, Taipeng, Huang, Junqiao, Zhu, Julie, Zhu, Deyong, Liu, Yizhen, He, Chuanxin, Zhang, Junmin, Zhou, Xuechang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2016
Materias:
Communications
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5323856/
https://www.ncbi.nlm.nih.gov/pubmed/28251052
http://dx.doi.org/10.1002/advs.201600313
Descripción
Sumario:A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution. [Image: see text]

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