Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition

A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This...

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Detalles Bibliográficos
Autores principales: Liang, Suqing, Li, Yaoyao, Zhou, Tingjiao, Yang, Jinbin, Zhou, Xiaohu, Zhu, Taipeng, Huang, Junqiao, Zhu, Julie, Zhu, Deyong, Liu, Yizhen, He, Chuanxin, Zhang, Junmin, Zhou, Xuechang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2016
Materias:
Communications
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5323856/
https://www.ncbi.nlm.nih.gov/pubmed/28251052
http://dx.doi.org/10.1002/advs.201600313
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author Liang, Suqing
Li, Yaoyao
Zhou, Tingjiao
Yang, Jinbin
Zhou, Xiaohu
Zhu, Taipeng
Huang, Junqiao
Zhu, Julie
Zhu, Deyong
Liu, Yizhen
He, Chuanxin
Zhang, Junmin
Zhou, Xuechang
author_facet Liang, Suqing
Li, Yaoyao
Zhou, Tingjiao
Yang, Jinbin
Zhou, Xiaohu
Zhu, Taipeng
Huang, Junqiao
Zhu, Julie
Zhu, Deyong
Liu, Yizhen
He, Chuanxin
Zhang, Junmin
Zhou, Xuechang
author_sort Liang, Suqing
collection PubMed
description A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution. [Image: see text]
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spelling pubmed-53238562017-03-01 Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition Liang, Suqing Li, Yaoyao Zhou, Tingjiao Yang, Jinbin Zhou, Xiaohu Zhu, Taipeng Huang, Junqiao Zhu, Julie Zhu, Deyong Liu, Yizhen He, Chuanxin Zhang, Junmin Zhou, Xuechang Adv Sci (Weinh) Communications A low‐cost, solution‐processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer‐assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution. [Image: see text] John Wiley and Sons Inc. 2016-11-01 /pmc/articles/PMC5323856/ /pubmed/28251052 http://dx.doi.org/10.1002/advs.201600313 Text en © 2016 The Authors. Published by WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim This is an open access article under the terms of the Creative Commons Attribution (http://creativecommons.org/licenses/by/4.0/) License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.
spellingShingle Communications
Liang, Suqing
Li, Yaoyao
Zhou, Tingjiao
Yang, Jinbin
Zhou, Xiaohu
Zhu, Taipeng
Huang, Junqiao
Zhu, Julie
Zhu, Deyong
Liu, Yizhen
He, Chuanxin
Zhang, Junmin
Zhou, Xuechang
Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title_full Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title_fullStr Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title_full_unstemmed Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title_short Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
title_sort microfluidic patterning of metal structures for flexible conductors by in situ polymer‐assisted electroless deposition
topic Communications
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5323856/
https://www.ncbi.nlm.nih.gov/pubmed/28251052
http://dx.doi.org/10.1002/advs.201600313
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