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Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces

Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride (h-BN) with an atomically smooth surface has been widely used as a passivati...

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Autores principales: Liu, Yi, Ong, Zhun-Yong, Wu, Jing, Zhao, Yunshan, Watanabe, Kenji, Taniguchi, Takashi, Chi, Dongzhi, Zhang, Gang, Thong, John T. L., Qiu, Cheng-Wei, Hippalgaonkar, Kedar
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5338337/
https://www.ncbi.nlm.nih.gov/pubmed/28262778
http://dx.doi.org/10.1038/srep43886
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author Liu, Yi
Ong, Zhun-Yong
Wu, Jing
Zhao, Yunshan
Watanabe, Kenji
Taniguchi, Takashi
Chi, Dongzhi
Zhang, Gang
Thong, John T. L.
Qiu, Cheng-Wei
Hippalgaonkar, Kedar
author_facet Liu, Yi
Ong, Zhun-Yong
Wu, Jing
Zhao, Yunshan
Watanabe, Kenji
Taniguchi, Takashi
Chi, Dongzhi
Zhang, Gang
Thong, John T. L.
Qiu, Cheng-Wei
Hippalgaonkar, Kedar
author_sort Liu, Yi
collection PubMed
description Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride (h-BN) with an atomically smooth surface has been widely used as a passivation layer to improve carrier transport for other 2D materials, especially for Transition Metal Dichalcogenides (TMDCs). However, heat flow at the interface between TMDCs and h-BN, which will play an important role in thermal management of various electronic and optoelectronic devices, is not yet understood. In this paper, for the first time, the interface thermal conductance (G) at the MoS(2)/h-BN interface is measured by Raman spectroscopy, and the room-temperature value is (17.0 ± 0.4) MW · m(−2)K(−1). For comparison, G between graphene and h-BN is also measured, with a value of (52.2 ± 2.1) MW · m(−2)K(−1). Non-equilibrium Green’s function (NEGF) calculations, from which the phonon transmission spectrum can be obtained, show that the lower G at the MoS(2)/h-BN interface is due to the weaker cross-plane transmission of phonon modes compared to graphene/h-BN. This study demonstrates that the MoS(2)/h-BN interface limits cross-plane heat dissipation, and thereby could impact the design and applications of 2D devices while considering critical thermal management.
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spelling pubmed-53383372017-03-08 Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces Liu, Yi Ong, Zhun-Yong Wu, Jing Zhao, Yunshan Watanabe, Kenji Taniguchi, Takashi Chi, Dongzhi Zhang, Gang Thong, John T. L. Qiu, Cheng-Wei Hippalgaonkar, Kedar Sci Rep Article Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride (h-BN) with an atomically smooth surface has been widely used as a passivation layer to improve carrier transport for other 2D materials, especially for Transition Metal Dichalcogenides (TMDCs). However, heat flow at the interface between TMDCs and h-BN, which will play an important role in thermal management of various electronic and optoelectronic devices, is not yet understood. In this paper, for the first time, the interface thermal conductance (G) at the MoS(2)/h-BN interface is measured by Raman spectroscopy, and the room-temperature value is (17.0 ± 0.4) MW · m(−2)K(−1). For comparison, G between graphene and h-BN is also measured, with a value of (52.2 ± 2.1) MW · m(−2)K(−1). Non-equilibrium Green’s function (NEGF) calculations, from which the phonon transmission spectrum can be obtained, show that the lower G at the MoS(2)/h-BN interface is due to the weaker cross-plane transmission of phonon modes compared to graphene/h-BN. This study demonstrates that the MoS(2)/h-BN interface limits cross-plane heat dissipation, and thereby could impact the design and applications of 2D devices while considering critical thermal management. Nature Publishing Group 2017-03-06 /pmc/articles/PMC5338337/ /pubmed/28262778 http://dx.doi.org/10.1038/srep43886 Text en Copyright © 2017, The Author(s) http://creativecommons.org/licenses/by/4.0/ This work is licensed under a Creative Commons Attribution 4.0 International License. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in the credit line; if the material is not included under the Creative Commons license, users will need to obtain permission from the license holder to reproduce the material. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/
spellingShingle Article
Liu, Yi
Ong, Zhun-Yong
Wu, Jing
Zhao, Yunshan
Watanabe, Kenji
Taniguchi, Takashi
Chi, Dongzhi
Zhang, Gang
Thong, John T. L.
Qiu, Cheng-Wei
Hippalgaonkar, Kedar
Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title_full Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title_fullStr Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title_full_unstemmed Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title_short Thermal Conductance of the 2D MoS(2)/h-BN and graphene/h-BN Interfaces
title_sort thermal conductance of the 2d mos(2)/h-bn and graphene/h-bn interfaces
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5338337/
https://www.ncbi.nlm.nih.gov/pubmed/28262778
http://dx.doi.org/10.1038/srep43886
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