Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are...

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Detalles Bibliográficos
Autores principales: Zhang, Zhongkai, Tian, Bian, Yu, Qiuyue, Shi, Peng, Lin, Qijing, Zhao, Na, Jing, Weixuan, Jiang, Zhuangde
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5424734/
https://www.ncbi.nlm.nih.gov/pubmed/28420088
http://dx.doi.org/10.3390/s17040857
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author Zhang, Zhongkai
Tian, Bian
Yu, Qiuyue
Shi, Peng
Lin, Qijing
Zhao, Na
Jing, Weixuan
Jiang, Zhuangde
author_facet Zhang, Zhongkai
Tian, Bian
Yu, Qiuyue
Shi, Peng
Lin, Qijing
Zhao, Na
Jing, Weixuan
Jiang, Zhuangde
author_sort Zhang, Zhongkai
collection PubMed
description A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch.
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spelling pubmed-54247342017-05-12 Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates Zhang, Zhongkai Tian, Bian Yu, Qiuyue Shi, Peng Lin, Qijing Zhao, Na Jing, Weixuan Jiang, Zhuangde Sensors (Basel) Article A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch. MDPI 2017-04-14 /pmc/articles/PMC5424734/ /pubmed/28420088 http://dx.doi.org/10.3390/s17040857 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zhang, Zhongkai
Tian, Bian
Yu, Qiuyue
Shi, Peng
Lin, Qijing
Zhao, Na
Jing, Weixuan
Jiang, Zhuangde
Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title_full Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title_fullStr Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title_full_unstemmed Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title_short Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates
title_sort range analysis of thermal stress and optimal design for tungsten-rhenium thin film thermocouples based on ceramic substrates
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5424734/
https://www.ncbi.nlm.nih.gov/pubmed/28420088
http://dx.doi.org/10.3390/s17040857
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