Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are...

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Detalles Bibliográficos
Autores principales: Zhang, Zhongkai, Tian, Bian, Yu, Qiuyue, Shi, Peng, Lin, Qijing, Zhao, Na, Jing, Weixuan, Jiang, Zhuangde
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5424734/
https://www.ncbi.nlm.nih.gov/pubmed/28420088
http://dx.doi.org/10.3390/s17040857

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5424734/
https://www.ncbi.nlm.nih.gov/pubmed/28420088
http://dx.doi.org/10.3390/s17040857

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