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Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement

This study proposes a simple method of fabricating flexible electronic devices using a metal template for passive alignment between chip components and an interconnect layer, which enabled efficient alignment with high accuracy. An electrocardiogram (ECG) sensor was fabricated using 20 µm thick poly...

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Detalles Bibliográficos
Autores principales: Ryu, Jin Hwa, Byun, Sangwon, Baek, In-Bok, Lee, Bong Kuk, Jang, Won Ick, Jang, Eun-Hye, Kim, Ah-Yung, Yu, Han Yung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5426539/
https://www.ncbi.nlm.nih.gov/pubmed/28420219
http://dx.doi.org/10.3390/s17040889
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author Ryu, Jin Hwa
Byun, Sangwon
Baek, In-Bok
Lee, Bong Kuk
Jang, Won Ick
Jang, Eun-Hye
Kim, Ah-Yung
Yu, Han Yung
author_facet Ryu, Jin Hwa
Byun, Sangwon
Baek, In-Bok
Lee, Bong Kuk
Jang, Won Ick
Jang, Eun-Hye
Kim, Ah-Yung
Yu, Han Yung
author_sort Ryu, Jin Hwa
collection PubMed
description This study proposes a simple method of fabricating flexible electronic devices using a metal template for passive alignment between chip components and an interconnect layer, which enabled efficient alignment with high accuracy. An electrocardiogram (ECG) sensor was fabricated using 20 µm thick polyimide (PI) film as a flexible substrate to demonstrate the feasibility of the proposed method. The interconnect layer was fabricated by a two-step photolithography process and evaporation. After applying solder paste, the metal template was placed on top of the interconnect layer. The metal template had rectangular holes at the same position as the chip components on the interconnect layer. Rectangular hole sizes were designed to account for alignment tolerance of the chips. Passive alignment was performed by simply inserting the components in the holes of the template, which resulted in accurate alignment with positional tolerance of less than 10 µm based on the structural design, suggesting that our method can efficiently perform chip mounting with precision. Furthermore, a fabricated flexible ECG sensor was easily attachable to the curved skin surface and able to measure ECG signals from a human subject. These results suggest that the proposed method can be used to fabricate epidermal sensors, which are mounted on the skin to measure various physiological signals.
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spelling pubmed-54265392017-05-12 Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement Ryu, Jin Hwa Byun, Sangwon Baek, In-Bok Lee, Bong Kuk Jang, Won Ick Jang, Eun-Hye Kim, Ah-Yung Yu, Han Yung Sensors (Basel) Article This study proposes a simple method of fabricating flexible electronic devices using a metal template for passive alignment between chip components and an interconnect layer, which enabled efficient alignment with high accuracy. An electrocardiogram (ECG) sensor was fabricated using 20 µm thick polyimide (PI) film as a flexible substrate to demonstrate the feasibility of the proposed method. The interconnect layer was fabricated by a two-step photolithography process and evaporation. After applying solder paste, the metal template was placed on top of the interconnect layer. The metal template had rectangular holes at the same position as the chip components on the interconnect layer. Rectangular hole sizes were designed to account for alignment tolerance of the chips. Passive alignment was performed by simply inserting the components in the holes of the template, which resulted in accurate alignment with positional tolerance of less than 10 µm based on the structural design, suggesting that our method can efficiently perform chip mounting with precision. Furthermore, a fabricated flexible ECG sensor was easily attachable to the curved skin surface and able to measure ECG signals from a human subject. These results suggest that the proposed method can be used to fabricate epidermal sensors, which are mounted on the skin to measure various physiological signals. MDPI 2017-04-18 /pmc/articles/PMC5426539/ /pubmed/28420219 http://dx.doi.org/10.3390/s17040889 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Ryu, Jin Hwa
Byun, Sangwon
Baek, In-Bok
Lee, Bong Kuk
Jang, Won Ick
Jang, Eun-Hye
Kim, Ah-Yung
Yu, Han Yung
Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title_full Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title_fullStr Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title_full_unstemmed Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title_short Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
title_sort integrated flexible electronic devices based on passive alignment for physiological measurement
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5426539/
https://www.ncbi.nlm.nih.gov/pubmed/28420219
http://dx.doi.org/10.3390/s17040889
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