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Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications
The recent implementation of new environmental legislations led to a change in the manufacturing of composites that has repercussions on printed wiring boards (PWB). This in turn led to alternate processing methods (e.g., lead-free soldering), which affected the required physical and chemical proper...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2010
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5445825/ https://www.ncbi.nlm.nih.gov/pubmed/28883331 http://dx.doi.org/10.3390/ma3084300 |
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author | Rakotomalala, Muriel Wagner, Sebastian Döring, Manfred |
author_facet | Rakotomalala, Muriel Wagner, Sebastian Döring, Manfred |
author_sort | Rakotomalala, Muriel |
collection | PubMed |
description | The recent implementation of new environmental legislations led to a change in the manufacturing of composites that has repercussions on printed wiring boards (PWB). This in turn led to alternate processing methods (e.g., lead-free soldering), which affected the required physical and chemical properties of the additives used to impart flame retardancy. This review will discuss the latest advancements in phosphorus containing flame retardants for electrical and electronic (EE) applications and compare them with commercially available ones. The mechanism of degradation and flame retardancy of phosphorus flame retardants in epoxy resins will also be discussed. |
format | Online Article Text |
id | pubmed-5445825 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2010 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-54458252017-07-28 Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications Rakotomalala, Muriel Wagner, Sebastian Döring, Manfred Materials (Basel) Review The recent implementation of new environmental legislations led to a change in the manufacturing of composites that has repercussions on printed wiring boards (PWB). This in turn led to alternate processing methods (e.g., lead-free soldering), which affected the required physical and chemical properties of the additives used to impart flame retardancy. This review will discuss the latest advancements in phosphorus containing flame retardants for electrical and electronic (EE) applications and compare them with commercially available ones. The mechanism of degradation and flame retardancy of phosphorus flame retardants in epoxy resins will also be discussed. MDPI 2010-08-11 /pmc/articles/PMC5445825/ /pubmed/28883331 http://dx.doi.org/10.3390/ma3084300 Text en © 2010 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/3.0/). |
spellingShingle | Review Rakotomalala, Muriel Wagner, Sebastian Döring, Manfred Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title | Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title_full | Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title_fullStr | Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title_full_unstemmed | Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title_short | Recent Developments in Halogen Free Flame Retardants for Epoxy Resins for Electrical and Electronic Applications |
title_sort | recent developments in halogen free flame retardants for epoxy resins for electrical and electronic applications |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5445825/ https://www.ncbi.nlm.nih.gov/pubmed/28883331 http://dx.doi.org/10.3390/ma3084300 |
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