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Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the...

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Detalles Bibliográficos
Autores principales:	Yang, Fan, Zhang, Liang, Liu, Zhi-quan, Zhong, Su Juan, Ma, Jia, Bao, Li
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2017
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458988/ https://www.ncbi.nlm.nih.gov/pubmed/28772917 http://dx.doi.org/10.3390/ma10050558

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