Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na(2)SO(4) was studied. Results showed that, under the bias voltage of 12 V, t...

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Detalles Bibliográficos
Autores principales: Yi, Pan, Xiao, Kui, Ding, Kangkang, Dong, Chaofang, Li, Xiaogang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5459160/
https://www.ncbi.nlm.nih.gov/pubmed/28772497
http://dx.doi.org/10.3390/ma10020137

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5459160/
https://www.ncbi.nlm.nih.gov/pubmed/28772497
http://dx.doi.org/10.3390/ma10020137

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