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Fabrication of Circuits on Flexible Substrates Using Conductive SU-8 for Sensing Applications
This article describes a new low-cost rapid microfabrication technology for high-density interconnects and passive devices on flexible substrates for sensing applications. Silver nanoparticles with an average size of 80 nm were used to create a conductive SU-8 mixture with a concentration of wt 25%....
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5492358/ https://www.ncbi.nlm.nih.gov/pubmed/28629134 http://dx.doi.org/10.3390/s17061420 |