Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal load...

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Detalles Bibliográficos
Autores principales: Schiavone, Giuseppe, Murray, Jeremy, Perry, Richard, Mount, Andrew R., Desmulliez, Marc P. Y., Walton, Anthony J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5503316/
https://www.ncbi.nlm.nih.gov/pubmed/28772683
http://dx.doi.org/10.3390/ma10030323

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5503316/
https://www.ncbi.nlm.nih.gov/pubmed/28772683
http://dx.doi.org/10.3390/ma10030323

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