Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer

Cu(6)Sn(5) whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag(3)Sn fibers can be observed around Cu(6)Sn(5) whiskers in the matrix microstructure, which can play an active e...

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Detalles Bibliográficos
Autores principales: Zhang, Liang, Liu, Zhi-quan, Yang, Fan, Zhong, Su-juan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5506998/
https://www.ncbi.nlm.nih.gov/pubmed/28772686
http://dx.doi.org/10.3390/ma10040327
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author Zhang, Liang
Liu, Zhi-quan
Yang, Fan
Zhong, Su-juan
author_facet Zhang, Liang
Liu, Zhi-quan
Yang, Fan
Zhong, Su-juan
author_sort Zhang, Liang
collection PubMed
description Cu(6)Sn(5) whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag(3)Sn fibers can be observed around Cu(6)Sn(5) whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu(6)Sn(5) whiskers can be observed, and hexagonal rod structure is the main morphology of Cu(6)Sn(5) whiskers. A hollow structure can be observed in hexagonal Cu(6)Sn(5) whiskers, and a screw dislocation mechanism was used to represent the Cu(6)Sn(5) growth. Based on mechanical property testing and finite element simulation, Cu(6)Sn(5) whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer.
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spelling pubmed-55069982017-07-28 Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer Zhang, Liang Liu, Zhi-quan Yang, Fan Zhong, Su-juan Materials (Basel) Article Cu(6)Sn(5) whiskers precipitated in Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer were found and investigated after reflow soldering and during aging. Ag(3)Sn fibers can be observed around Cu(6)Sn(5) whiskers in the matrix microstructure, which can play an active effect on the reliability of interconnection. Different morphologies of Cu(6)Sn(5) whiskers can be observed, and hexagonal rod structure is the main morphology of Cu(6)Sn(5) whiskers. A hollow structure can be observed in hexagonal Cu(6)Sn(5) whiskers, and a screw dislocation mechanism was used to represent the Cu(6)Sn(5) growth. Based on mechanical property testing and finite element simulation, Cu(6)Sn(5) whiskers were regarded as having a negative effect on the durability of Sn3.0Ag0.5Cu/Cu interconnection in concentrator silicon solar cells solder layer. MDPI 2017-03-23 /pmc/articles/PMC5506998/ /pubmed/28772686 http://dx.doi.org/10.3390/ma10040327 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Zhang, Liang
Liu, Zhi-quan
Yang, Fan
Zhong, Su-juan
Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title_full Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title_fullStr Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title_full_unstemmed Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title_short Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
title_sort cu(6)sn(5) whiskers precipitated in sn3.0ag0.5cu/cu interconnection in concentrator silicon solar cells solder layer
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5506998/
https://www.ncbi.nlm.nih.gov/pubmed/28772686
http://dx.doi.org/10.3390/ma10040327
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