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Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs
We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm [Formula: see text] ·V [Formula: see text] ·s [Formula: see text] a turn-on voltage of −0.8 V...
Autores principales: | , , , , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5509041/ https://www.ncbi.nlm.nih.gov/pubmed/28773743 http://dx.doi.org/10.3390/ma9080623 |
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author | Hu, Shiben Fang, Zhiqiang Ning, Honglong Tao, Ruiqiang Liu, Xianzhe Zeng, Yong Yao, Rihui Huang, Fuxiang Li, Zhengcao Xu, Miao Wang, Lei Lan, Linfeng Peng, Junbiao |
author_facet | Hu, Shiben Fang, Zhiqiang Ning, Honglong Tao, Ruiqiang Liu, Xianzhe Zeng, Yong Yao, Rihui Huang, Fuxiang Li, Zhengcao Xu, Miao Wang, Lei Lan, Linfeng Peng, Junbiao |
author_sort | Hu, Shiben |
collection | PubMed |
description | We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm [Formula: see text] ·V [Formula: see text] ·s [Formula: see text] a turn-on voltage of −0.8 V and a low subthreshold swing of 0.47 V/decade. Cu diffusion is suppressed because pre-annealing can protect a-IGZO from damage during the electrode sputtering and reduce the copper diffusion paths by making film denser. Due to the interaction of Cr with a-IGZO, the carrier concentration of a-IGZO, which is responsible for high mobility, rises. |
format | Online Article Text |
id | pubmed-5509041 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2016 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-55090412017-07-28 Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs Hu, Shiben Fang, Zhiqiang Ning, Honglong Tao, Ruiqiang Liu, Xianzhe Zeng, Yong Yao, Rihui Huang, Fuxiang Li, Zhengcao Xu, Miao Wang, Lei Lan, Linfeng Peng, Junbiao Materials (Basel) Article We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm [Formula: see text] ·V [Formula: see text] ·s [Formula: see text] a turn-on voltage of −0.8 V and a low subthreshold swing of 0.47 V/decade. Cu diffusion is suppressed because pre-annealing can protect a-IGZO from damage during the electrode sputtering and reduce the copper diffusion paths by making film denser. Due to the interaction of Cr with a-IGZO, the carrier concentration of a-IGZO, which is responsible for high mobility, rises. MDPI 2016-07-27 /pmc/articles/PMC5509041/ /pubmed/28773743 http://dx.doi.org/10.3390/ma9080623 Text en © 2016 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Hu, Shiben Fang, Zhiqiang Ning, Honglong Tao, Ruiqiang Liu, Xianzhe Zeng, Yong Yao, Rihui Huang, Fuxiang Li, Zhengcao Xu, Miao Wang, Lei Lan, Linfeng Peng, Junbiao Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title | Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title_full | Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title_fullStr | Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title_full_unstemmed | Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title_short | Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs |
title_sort | effect of post treatment for cu-cr source/drain electrodes on a-igzo tfts |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5509041/ https://www.ncbi.nlm.nih.gov/pubmed/28773743 http://dx.doi.org/10.3390/ma9080623 |
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