Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

Packaging represents an important part in the microintegration of sensors based on microelectromechanical system (MEMS). Besides miniaturization and integration density, functionality and reliability in combination with flexibility in packaging design at moderate costs and consequently high-mix, low...

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Detalles Bibliográficos
Autores principales: Hera, Daniel, Berndt, Armin, Günther, Thomas, Schmiel, Stephan, Harendt, Christine, Zimmermann, André
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5539550/
https://www.ncbi.nlm.nih.gov/pubmed/28653992
http://dx.doi.org/10.3390/s17071511

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5539550/
https://www.ncbi.nlm.nih.gov/pubmed/28653992
http://dx.doi.org/10.3390/s17071511

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