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Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi so...

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Autores principales: Wang, Fengjiang, Huang, Ying, Zhang, Zhijie, Yan, Chao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5578286/
https://www.ncbi.nlm.nih.gov/pubmed/28792440
http://dx.doi.org/10.3390/ma10080920
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author Wang, Fengjiang
Huang, Ying
Zhang, Zhijie
Yan, Chao
author_facet Wang, Fengjiang
Huang, Ying
Zhang, Zhijie
Yan, Chao
author_sort Wang, Fengjiang
collection PubMed
description Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu(6)Sn(5) intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu(6)Sn(5) IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu(6)Sn(5) IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu(6)Sn(5) in solder matrix and the transition from Cu(6)Sn(5) to Cu(3)Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder.
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spelling pubmed-55782862017-09-05 Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints Wang, Fengjiang Huang, Ying Zhang, Zhijie Yan, Chao Materials (Basel) Article Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu(6)Sn(5) intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu(6)Sn(5) IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu(6)Sn(5) IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu(6)Sn(5) in solder matrix and the transition from Cu(6)Sn(5) to Cu(3)Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder. MDPI 2017-08-09 /pmc/articles/PMC5578286/ /pubmed/28792440 http://dx.doi.org/10.3390/ma10080920 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Wang, Fengjiang
Huang, Ying
Zhang, Zhijie
Yan, Chao
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title_full Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title_fullStr Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title_full_unstemmed Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title_short Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
title_sort interfacial reaction and mechanical properties of sn-bi solder joints
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5578286/
https://www.ncbi.nlm.nih.gov/pubmed/28792440
http://dx.doi.org/10.3390/ma10080920
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AT zhangzhijie interfacialreactionandmechanicalpropertiesofsnbisolderjoints
AT yanchao interfacialreactionandmechanicalpropertiesofsnbisolderjoints