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Wide-field mid-infrared hyperspectral imaging of adhesives using a bolometer camera

By combining a bolometer detector with an imaging-type interferometer, an inexpensive, easy-to-handle wide-field mid-infrared hyperspectral imaging apparatus was produced. We measured the distributions of four types of thin adhesive layers on an aluminium plate and analysed the results using correla...

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Detalles Bibliográficos
Autores principales: Sugawara, Shigeru, Nakayama, Yoshihiko, Taniguchi, Hideya, Ishimaru, Ichiro
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5622033/
https://www.ncbi.nlm.nih.gov/pubmed/28963529
http://dx.doi.org/10.1038/s41598-017-11994-4
Descripción
Sumario:By combining a bolometer detector with an imaging-type interferometer, an inexpensive, easy-to-handle wide-field mid-infrared hyperspectral imaging apparatus was produced. We measured the distributions of four types of thin adhesive layers on an aluminium plate and analysed the results using correlation coefficients to visualise the distribution of various adhesives that cannot be discerned by the naked eye or conventional methods such as visible/near-infrared spectroscopic/fluorescent photography. The measurement wavelength range, obtained spectrum’s wavenumber resolution, and measurement time was 8–14 μm, about 9 cm(−1), and about 30 s, respectively. Using conventional methods, adhesives could not be distinguished from the others. By using this method, we found that adhesives could be precisely distinguished by setting an appropriate threshold value for the correlation coefficient. Thus, our approach can accurately measure the spatial distribution of different types of adhesive that cannot be discriminated by conventional methods.