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Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink

With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due...

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Autores principales: Chen, Xiaolian, Wu, Xinzhou, Shao, Shuangshuang, Zhuang, Jinyong, Xie, Liming, Nie, Shuhong, Su, Wenming, Chen, Zheng, Cui, Zheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5643557/
https://www.ncbi.nlm.nih.gov/pubmed/29038555
http://dx.doi.org/10.1038/s41598-017-13617-4
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author Chen, Xiaolian
Wu, Xinzhou
Shao, Shuangshuang
Zhuang, Jinyong
Xie, Liming
Nie, Shuhong
Su, Wenming
Chen, Zheng
Cui, Zheng
author_facet Chen, Xiaolian
Wu, Xinzhou
Shao, Shuangshuang
Zhuang, Jinyong
Xie, Liming
Nie, Shuhong
Su, Wenming
Chen, Zheng
Cui, Zheng
author_sort Chen, Xiaolian
collection PubMed
description With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make metal-mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn metal-mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper metal-mesh TCFs.
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spelling pubmed-56435572017-10-19 Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink Chen, Xiaolian Wu, Xinzhou Shao, Shuangshuang Zhuang, Jinyong Xie, Liming Nie, Shuhong Su, Wenming Chen, Zheng Cui, Zheng Sci Rep Article With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make metal-mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn metal-mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper metal-mesh TCFs. Nature Publishing Group UK 2017-10-16 /pmc/articles/PMC5643557/ /pubmed/29038555 http://dx.doi.org/10.1038/s41598-017-13617-4 Text en © The Author(s) 2017 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Article
Chen, Xiaolian
Wu, Xinzhou
Shao, Shuangshuang
Zhuang, Jinyong
Xie, Liming
Nie, Shuhong
Su, Wenming
Chen, Zheng
Cui, Zheng
Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title_full Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title_fullStr Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title_full_unstemmed Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title_short Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink
title_sort hybrid printing metal-mesh transparent conductive films with lower energy photonically sintered copper/tin ink
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5643557/
https://www.ncbi.nlm.nih.gov/pubmed/29038555
http://dx.doi.org/10.1038/s41598-017-13617-4
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