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3D Defect Localization on Exothermic Faults within Multi-Layered Structures Using Lock-In Thermography: An Experimental and Numerical Approach

Micro-electronic devices are increasingly incorporating miniature multi-layered integrated architectures. However, the localization of faults in three-dimensional structure remains challenging. This study involved the experimental and numerical estimation of the depth of a thermally active heating s...

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Detalles Bibliográficos
Autores principales:	Bae, Ji Yong, Lee, Kye-Sung, Hur, Hwan, Nam, Ki-Hwan, Hong, Suk-Ju, Lee, Ah-Yeong, Chang, Ki Soo, Kim, Geon-Hee, Kim, Ghiseok
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2017
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5677311/ https://www.ncbi.nlm.nih.gov/pubmed/29027955 http://dx.doi.org/10.3390/s17102331

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Correction: Liu, B., et al. Quantitative Evaluation of Pulsed Thermography, Lock-In Thermography and Vibrothermography on Foreign Object Defect (FOD) in CFRP. Sensors 2016, 16, doi:10.3390/s16050743
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