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Shear-Assisted Production of Few-Layer Boron Nitride Nanosheets by Supercritical CO(2) Exfoliation and Its Use for Thermally Conductive Epoxy Composites

Boron nitride nanosheets (BNNS) hold the similar two-dimensional structure as graphene and unique properties complementary to graphene, which makes it attractive in application ranging from electronics to energy storage. The exfoliation of boron nitride (BN) still remains challenge and hinders the a...

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Detalles Bibliográficos
Autores principales: Tian, Xiaojuan, Li, Yun, Chen, Zhuo, Li, Qi, Hou, Liqiang, Wu, Jiaye, Tang, Yushu, Li, Yongfeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5736726/
https://www.ncbi.nlm.nih.gov/pubmed/29259272
http://dx.doi.org/10.1038/s41598-017-18149-5
Descripción
Sumario:Boron nitride nanosheets (BNNS) hold the similar two-dimensional structure as graphene and unique properties complementary to graphene, which makes it attractive in application ranging from electronics to energy storage. The exfoliation of boron nitride (BN) still remains challenge and hinders the applications of BNNS. In this work, the preparation of BNNS has been realized by a shear-assisted supercritical CO(2) exfoliation process, during which supercritical CO(2) intercalates and diffuses between boron nitride layers, and then the exfoliation of BN layers is obtained in the rapid depressurization process by overcoming the van der Waals forces. Our results indicate that the bulk boron nitride has been successfully exfoliated into thin nanosheets with an average 6 layers. It is found that the produced BNNS is well-dispersed in isopropyl alcohol (IPA) with a higher extinction coefficient compared with the bulk BN. Moreover, the BNNS/epoxy composite used as thermal interface materials has been prepared. The introduction of BNNS results in a 313% enhancement in thermal conductivity. Our results demonstrate that BNNS produced by supercritical CO(2) exfoliation show great potential applications for heat dissipation of high efficiency electronics.