Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during testing. We found that discrete voids nucleate, grow and coalesce along the intermetallic compound...

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Detalles Bibliográficos
Autores principales: Chang, Yuan-Wei, Cheng, Yin, Helfen, Lukas, Xu, Feng, Tian, Tian, Scheel, Mario, Di Michiel, Marco, Chen, Chih, Tu, King-Ning, Baumbach, Tilo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5738397/
https://www.ncbi.nlm.nih.gov/pubmed/29263329
http://dx.doi.org/10.1038/s41598-017-06250-8

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5738397/
https://www.ncbi.nlm.nih.gov/pubmed/29263329
http://dx.doi.org/10.1038/s41598-017-06250-8

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