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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation
In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and the 3D laminography imaging technique was employed for in-situ observation of the microstructure evolution during testing. We found that discrete voids nucleate, grow and coalesce along the intermetallic compound...
| Autores principales: | , , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2017
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5738397/ https://www.ncbi.nlm.nih.gov/pubmed/29263329 http://dx.doi.org/10.1038/s41598-017-06250-8 |