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Ultrathin silicon oxynitride layer on GaN for dangling-bond-free GaN/insulator interface

Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO(2) would...

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Detalles Bibliográficos
Autores principales: Nishio, Kengo, Yayama, Tomoe, Miyazaki, Takehide, Taoka, Noriyuki, Shimizu, Mitsuaki
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5780416/
https://www.ncbi.nlm.nih.gov/pubmed/29362443
http://dx.doi.org/10.1038/s41598-018-19283-4
Descripción
Sumario:Despite the scientific and technological importance of removing interface dangling bonds, even an ideal model of a dangling-bond-free interface between GaN and an insulator has not been known. The formation of an atomically thin ordered buffer layer between crystalline GaN and amorphous SiO(2) would be a key to synthesize a dangling-bond-free GaN/SiO(2) interface. Here, we predict that a silicon oxynitride (Si(4)O(5)N(3)) layer can epitaxially grow on a GaN(0001) surface without creating dangling bonds at the interface. Our ab initio calculations show that the GaN/Si(4)O(5)N(3) structure is more stable than silicon-oxide-terminated GaN(0001) surfaces. The electronic properties of the GaN/Si(4)O(5)N(3) structure can be tuned by modifying the chemical components near the interface. We also propose a possible approach to experimentally synthesize the GaN/Si(4)O(5)N(3) structure.