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Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce...

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Detalles Bibliográficos
Autores principales: Maxa, Jacob, Novikov, Andrej, Nowottnick, Mathias
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5793529/
http://dx.doi.org/10.3390/ma11010031
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author Maxa, Jacob
Novikov, Andrej
Nowottnick, Mathias
author_facet Maxa, Jacob
Novikov, Andrej
Nowottnick, Mathias
author_sort Maxa, Jacob
collection PubMed
description Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.
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spelling pubmed-57935292018-02-07 Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications Maxa, Jacob Novikov, Andrej Nowottnick, Mathias Materials (Basel) Proceedings Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs. MDPI 2017-12-26 /pmc/articles/PMC5793529/ http://dx.doi.org/10.3390/ma11010031 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Proceedings
Maxa, Jacob
Novikov, Andrej
Nowottnick, Mathias
Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title_full Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title_fullStr Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title_full_unstemmed Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title_short Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications
title_sort thermal peak management using organic phase change materials for latent heat storage in electronic applications
topic Proceedings
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5793529/
http://dx.doi.org/10.3390/ma11010031
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