Thermally-triggered Dual In-situ Self-healing Metallic Materials

The microstructural evolution and crack filling phenomena of (Al(81)Cu(13)Si(6))(100−x)(Sn(57)Bi(43))(x) (x = 0, 1, and 3 at.%) composites was investigated. The Sn and Bi elements were selected by considering the ability for liquid phase separation when combined with Al, Cu, and Si. Because of liquid phase separation, both Al-Cu-Si-rich L(1) and Sn-Bi-rich L(2) phases separately solidified at different temperatures yielding a trimodal eutectic structure in the cast alloys. The Sn and Bi elements have high mobilities due to the large interface of the eutectic microstructure and tend to strongly diffuse towards higher strained region during heat treatment. Furthermore, the mobile Sn and Bi elements in the Al-Cu-Si-based bimodal eutectic structure evidently fill cracks during warm rolling at 423 K. These results reveal that the developed alloy system has simultaneously dual self-healing characteristics, derived from the both precipitated Sn-Bi-rich particles and low melting agent, and the proposed alloy design based on liquid phase separation provides a novel strategy for creating self-crack filling metallic materials.