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Impact of Electrode Surface Morphology in ZnO-Based Resistive Random Access Memory Fabricated Using the Cu Chemical Displacement Technique
Electrochemical-metallization-type resistive random access memories (ReRAMs) show promising performance as next-generation nonvolatile memory. In this paper, the Cu chemical displacement technique (CDT) is used to form the bottom electrode of ReRAM devices. Compared with conventional deposition meth...
Autores principales: | Wu, Chi-Chang, You, Hsin-Chiang, Lin, Yu-Hsien, Yang, Chia-Jung, Hsiao, Yu-Ping, Liao, Tun-Po, Yang, Wen-Luh |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5848962/ https://www.ncbi.nlm.nih.gov/pubmed/29425135 http://dx.doi.org/10.3390/ma11020265 |
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