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Second Generation Small Pixel Technology Using Hybrid Bond Stacking †
In this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 techno...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5855510/ https://www.ncbi.nlm.nih.gov/pubmed/29495272 http://dx.doi.org/10.3390/s18020667 |
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author | Venezia, Vincent C. Hsiung, Alan Chih-Wei Yang, Wu-Zang Zhang, Yuying Zhao, Cheng Lin, Zhiqiang Grant, Lindsay A. |
author_facet | Venezia, Vincent C. Hsiung, Alan Chih-Wei Yang, Wu-Zang Zhang, Yuying Zhao, Cheng Lin, Zhiqiang Grant, Lindsay A. |
author_sort | Venezia, Vincent C. |
collection | PubMed |
description | In this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 µm pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology. |
format | Online Article Text |
id | pubmed-5855510 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-58555102018-03-20 Second Generation Small Pixel Technology Using Hybrid Bond Stacking † Venezia, Vincent C. Hsiung, Alan Chih-Wei Yang, Wu-Zang Zhang, Yuying Zhao, Cheng Lin, Zhiqiang Grant, Lindsay A. Sensors (Basel) Article In this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 technology achieves state-of-the-art low-light image-sensor performance for 1.1, 1.0, and 0.9 µm pixel products. Additional improvements on this technology include less than 100 ppm white-pixel process and a high near-infrared (NIR) QE technology. MDPI 2018-02-24 /pmc/articles/PMC5855510/ /pubmed/29495272 http://dx.doi.org/10.3390/s18020667 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Venezia, Vincent C. Hsiung, Alan Chih-Wei Yang, Wu-Zang Zhang, Yuying Zhao, Cheng Lin, Zhiqiang Grant, Lindsay A. Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title | Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title_full | Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title_fullStr | Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title_full_unstemmed | Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title_short | Second Generation Small Pixel Technology Using Hybrid Bond Stacking † |
title_sort | second generation small pixel technology using hybrid bond stacking † |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5855510/ https://www.ncbi.nlm.nih.gov/pubmed/29495272 http://dx.doi.org/10.3390/s18020667 |
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