Second Generation Small Pixel Technology Using Hybrid Bond Stacking †

In this work, OmniVision’s second generation (Gen2) of small-pixel BSI stacking technologies is reviewed. The key features of this technology are hybrid-bond stacking, deeper back-side, deep-trench isolation, new back-side composite metal-oxide grid, and improved gate oxide quality. This Gen2 techno...

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Detalles Bibliográficos
Autores principales: Venezia, Vincent C., Hsiung, Alan Chih-Wei, Yang, Wu-Zang, Zhang, Yuying, Zhao, Cheng, Lin, Zhiqiang, Grant, Lindsay A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5855510/
https://www.ncbi.nlm.nih.gov/pubmed/29495272
http://dx.doi.org/10.3390/s18020667

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5855510/
https://www.ncbi.nlm.nih.gov/pubmed/29495272
http://dx.doi.org/10.3390/s18020667

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