Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining

A facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in b...

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Detalles Bibliográficos
Autores principales: Wang, Shang, Tian, Yanhong, Hang, Chunjin, Wang, Chenxi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5869588/
https://www.ncbi.nlm.nih.gov/pubmed/29588503
http://dx.doi.org/10.1038/s41598-018-21777-0
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author Wang, Shang
Tian, Yanhong
Hang, Chunjin
Wang, Chenxi
author_facet Wang, Shang
Tian, Yanhong
Hang, Chunjin
Wang, Chenxi
author_sort Wang, Shang
collection PubMed
description A facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in bare Ag NW networks. The sheet resistance of Ag NW electrode drops from over 2000 Ω sq(−1) to 9.4 Ω sq(−1) with excellent thermal uniformity after the electroplating process within 10 s. Nickel enhanced Ag NW transparent films are applied on flexible heaters with good thermal stability (165 °C for 2 h) and mechanical flexibility (3500 cycles under 2.5 mm bending radius) after mechanical bending process. Moreover, the mechanism of nickel growth is also confirmed that the nickel electroplating of the Ag NWs obeyed Faraday’s Laws.
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spelling pubmed-58695882018-04-02 Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining Wang, Shang Tian, Yanhong Hang, Chunjin Wang, Chenxi Sci Rep Article A facile method for producing high-performance nickel enhanced silver nanowire (Ag NW) transparent electrodes on a flexible substrate is reported. The modified electroplating method called enhanced nickel ion bridge joining of Ag NWs, which provides a new route for improving the loose junctions in bare Ag NW networks. The sheet resistance of Ag NW electrode drops from over 2000 Ω sq(−1) to 9.4 Ω sq(−1) with excellent thermal uniformity after the electroplating process within 10 s. Nickel enhanced Ag NW transparent films are applied on flexible heaters with good thermal stability (165 °C for 2 h) and mechanical flexibility (3500 cycles under 2.5 mm bending radius) after mechanical bending process. Moreover, the mechanism of nickel growth is also confirmed that the nickel electroplating of the Ag NWs obeyed Faraday’s Laws. Nature Publishing Group UK 2018-03-27 /pmc/articles/PMC5869588/ /pubmed/29588503 http://dx.doi.org/10.1038/s41598-018-21777-0 Text en © The Author(s) 2018 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Article
Wang, Shang
Tian, Yanhong
Hang, Chunjin
Wang, Chenxi
Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title_full Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title_fullStr Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title_full_unstemmed Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title_short Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
title_sort cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5869588/
https://www.ncbi.nlm.nih.gov/pubmed/29588503
http://dx.doi.org/10.1038/s41598-018-21777-0
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