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Adsorption and protective behavior of BTAH on the initial atmospheric corrosion process of copper under thin film of chloride solutions

The initial corrosion process of copper and the corrosion resistance mechanism of Benzotriazole under chloride-containing thin electrolyte layer (TEL) was investigated. After theoretical calculation and experimental characterization, the forming process of [Cu(I)BTA](n) film was chemically adsorbed...

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Detalles Bibliográficos
Autores principales: Yi, Chenxi, Zhu, Benfeng, Chen, Yu, Du, Xiaoqing, Yang, Yumeng, Liu, Jiao, Zhang, Zhao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5884792/
https://www.ncbi.nlm.nih.gov/pubmed/29618834
http://dx.doi.org/10.1038/s41598-018-23927-w
Descripción
Sumario:The initial corrosion process of copper and the corrosion resistance mechanism of Benzotriazole under chloride-containing thin electrolyte layer (TEL) was investigated. After theoretical calculation and experimental characterization, the forming process of [Cu(I)BTA](n) film was chemically adsorbed on copper surface by Cu-N bond tightly; corrosion rate increased as TEL thickness decreased. Whilst, energy distribution plot of electrochemical noise provided the validity of corrosion type, and the purported corrosion energy (E(c)) deduced from electrochemical noise was approximately proportion to corrosion rate (1/R(ct)) with and without the anticorrosion film, which denoted the feasibility to determine corrosion rate by nondestructive on-line monitoring electrochemical noise progress.