Tensile behavior of Cu-coated Pd(40)Cu(30)Ni(10)P(20) metallic glassy wire

Catastrophic brittle fracture of monolithic metallic glass (MG) hinders engineering application of MGs. Although many techniques has been tried to enhance tensile ductility of metallic glasses, the enhancement is quite limited. Here, we show the effect of electrodeposited Cu coating on tensile plasticity enhancement of Pd(40)Cu(30)Ni(10)P(20) MG wires, with different volume fractions of copper coatings (R), from 0% to 97%. With increasing R, tensile elongation is enhanced to 7.1%. The plasticity enhancement is due to confinement of the Cu coatings, which lead to multiple and secondary shear bands, according to SEM investigations. In addition, the SEM images also show that the patterns on the fracture surface of the Cu-coated MG wires vary with volume fraction of the Cu coatings. The size of shear offset decreases with increasing R. The viscous fingerings on the fracture surface of monolithic MG wire changes into dimples on the fracture surface of Cu coated MG wires with R of 90% and 97%. The electrodeposition technique used in this work provides a useful way to enhance plasticity of monolithic MGs under tensile loading at room temperature.