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Reliability Criteria for Thick Bonding Wire

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. El...

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Detalles Bibliográficos
Autores principales: Dagdelen, Turker, Abdel-Rahman, Eihab, Yavuz, Mustafa
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5951502/
https://www.ncbi.nlm.nih.gov/pubmed/29673194
http://dx.doi.org/10.3390/ma11040618